Scaling & Integration of High-Speed Electron & Optomechan
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Book Overview Coined as the third revolution in electronics is under way; Manufacturing is going digital, driven by computing revolution, powered by MO...
Coined as the third revolution in electronics is under way; Manufacturing is going digital, driven by computing revolution, powered by MOS technology, in particular, by the CMOS technology and its development.
In this book, the scaling challenges for CMOS: SiGe BiCMOS, THz and niche technology are covered; the first article looks at scaling challenges for CMOS from an industrial point of view (review of the latest innovations); the second article focuses on SiGe BiCMOS technologies (deals with high-speed up to the THz-region), and the third article reports on circuits associated with source/drain integration in 14 nm and beyond FinFET technology nodes. Followed by the last two articles on niche applications for emerging technologies: one deals with carbon nanotube network and plasmonics for the THz region carbon, while the other reviews the recent developments in integrated on-chip nano-optomechanical systems.
Book Details Format: Hardcover | Pages: 141 | Language: English | Publisher: WORLD SCIENTIFIC PUB CO INC | ISBN: 9813225394
FormatHardcover
Pages141
LanguageEnglish
ISBN9813225394
EAN9789813225398
PublisherWORLD SCIENTIFIC PUB CO INC
Publication Date1970-01-01
AccessoriesNo Accessory
ConditionNew
Product TypeHARD COVER BOOKS
Weight1.27 Pounds
Length9.8 Inches
Width6.6 Inches
Height0.6 Inches
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