Cooling of Microelectronic and Nanoelectronic Equipment
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Book Overview To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from va...
To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.
This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.
Book Details Format: Hardcover | Pages: 460 | Language: English | Publisher: WORLD SCIENTIFIC PUB CO INC | ISBN: 9814579785
FormatHardcover
Pages460
LanguageEnglish
ISBN9814579785
EAN9789814579780
PublisherWORLD SCIENTIFIC PUB CO INC
Publication Date1970-01-01
Edition1
AccessoriesNo Accessory
ConditionNew
Product TypeHARD COVER BOOKS
Weight1.76 Pounds
Length9.1 Inches
Width6.1 Inches
Height1.2 Inches
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