Reliability Prediction from Burn-In Data Fit to Reliability Models
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AlbakiReads Editorial A reliability-modeling guide for semiconductor design decisions
A reliability-modeling guide for semiconductor design decisions
Joseph Bernstein presents a method for estimating circuit and system reliability from burn-in data, manufacturer information, and HTOL end-of-life testing. The book connects qualification-stage evidence with predictions of field failures under chip-level operating conditions. Its practical emphasis is on calculating FIT and DPPM values in relation to factors such as operating conditions and chip temperature, placing reliability alongside performance during the design process. At 108 pages, it is a focused technical resource centered on applying reliability models to semiconductor components and systems.
Good fit for readers who enjoy
- Chip and system designers working with semiconductor reliability
- Engineers using burn-in or HTOL qualification data
- Technical readers seeking guidance on FIT and DPPM prediction
Themes
Semiconductor reliabilityBurn-in dataHTOL testingFailure-rate predictionDesign operating conditions
Based on publisher information and book metadata.
Book Overview This work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimat...
This work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimate failures that will occur in the field as a function of operating conditions at the chip level. This book will combine the knowledge taught in many reliability publications and illustrate how to use the knowledge presented by the semiconductor manufacturing companies in combination with the HTOL end-of-life testing that is currently performed by the chip suppliers as part of their standard qualification procedure and make accurate reliability predictions. This book will allow chip designers to predict FIT and DPPM values as a function of operating conditions and chip temperature so that users ultimately will have control of reliability in their design so the reliability and performance will be considered concurrently with their design.
Book Details Format: Paperback | Pages: 108 | Language: English | Publisher: ACADEMIC PR INC | ISBN: 0128007478
FormatPaperback
Pages108
LanguageEnglish
ISBN0128007478
EAN9780128007471
PublisherACADEMIC PR INC
Publication Date2014-03-21
Edition1
AccessoriesNo Accessory
ConditionNew
Product TypeQUALITY PAPERBACK BOOKS
Weight0.34 Pounds
Length9.0 Inches
Width6.0 Inches
Height0.22 Inches
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