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Reliability Prediction from Burn-In Data Fit to Reliability Models

Bernstein, Joseph

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Paperback

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This work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimate failures that will occur in the field as a function of operating conditions at the chip level. This book will combine the knowledge taught in many reliability publications and illustrate how to use the knowledge presented by the semiconductor manufacturing companies in combination with the HTOL end-of-life testing that is currently performed by the chip suppliers as part of their standard qualification procedure and make accurate reliability predictions. This book will allow chip designers to predict FIT and DPPM values as a function of operating conditions and chip temperature so that users ultimately will have control of reliability in their design so the reliability and performance will be considered concurrently with their design.

Accessories:

No Accessory

Publisher

ACADEMIC PR INC

Bisac Major Subject

Computers

Binding Type

Paperback

Country Of Origin

Number Of Units

Length

9.0 Inches

Barcode Indicator

EAN

Width

6.0 Inches

Publication Date

1970-01-01

Height

0.22 Inches

ISBN 10

0128007478

Weight

0.34 Pounds

Book EAN

9780128007471

Target Audiance

Adults

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Reliability Prediction from Burn-In Data Fit to Reliability Models